Comments on: Industry Behemoths Back Intel’s Universal Chiplet Interconnect

By: Timothy Prickett Morgan

Timothy Prickett Morgan — Tue, 08 Mar 2022 21:33:34 +0000

In reply to Just a Realist. Fair points all around.

By: Just a Realist

Just a Realist — Tue, 08 Mar 2022 19:28:02 +0000

Outside of declaring yet another Intel-developed interconnect an industry standard, where is the breakthrough innovation? At best, UCIe might provide incremental innovation, but appears to be little more than yet-another-interconnect to carry other industry standard protocols (PCIe, CXL, etc.) within a single package (don’t get too far ahead of yourself promising that it will become the dominant board / rack-level protocol). One also needs to keep in mind that though many within the industry have already or are moving to chiplet-based designs with some to wafer-based, many of these companies are developing vertical designs and integrated components / platforms in order to maximize customer-visible value and differentiation, and most importantly, their component or service-based profit margin. As such, it is critical to keep in mind that though many heavy hitters will join a given industry standards body, a vast majority are there primarily to observe and rarely contribute to the actual technology’s development or consumption (far too many examples of industry standards touting amazing, breakthrough benefits only to fail and be forgotten).

By: drive-by poster

drive-by poster — Mon, 07 Mar 2022 22:03:32 +0000

In reply to Matt.

“Nvidia doesn’t even want to make chips for people, I doubt they want to make chiplets for people.”

But they probably want to make chips that can accommodate other companies’ IP. To host, as well as to guest, you need to speak the protocol. They may continue to evolve NVLink for themselves for a while… but why?

By: Matt

Matt — Thu, 03 Mar 2022 05:23:19 +0000

Nvidia doesn’t even want to make chips for people, I doubt they want to make chiplets for people.

By: JayN

JayN — Wed, 02 Mar 2022 23:26:14 +0000

Thanks for the nice detail on this announcement.
A few comments …
1. obvious to me that 4, 8, 16 lane external pcie interconnects could be expanded to very wide paths on-chip, as on hbme memories.
2. Intel has integrated wifi6e and thunderbolt4 designs that seem like a good prospect to be sold as chiplet components.
3. Someone at Intel gave a presentation, indicating that Optane could be moved behind an off-chip cxl memory controller. This also seems like a good prospect for an in-package chiplet component.

By: Sam lebon

Sam lebon — Wed, 02 Mar 2022 21:30:09 +0000

Everything Intel is trying to do on paper, AMD have already done on silicon, and will be demonstrated when the fastest computer is soon brought online.

Infinity Fabric is what makes AMD’s solutions stand out.